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270 结果
制造商零件编号 数量 价格 系列 包装 状态 特征 引脚数 安装类型 转换自(适配器端) 转换为(适配器端) 工作温度 终止 材料可燃性等级 筑屋材料 间距 - 交配 接触面完成 - 配合 接触面表面厚度 - 配合 触点材料 - 配合 俯仰 - 后 联系完成 - 后 接触表面厚度 - 柱 联系材料 - 邮政 端接柱长度 板材材质 额定电流(安培)
83
In Stock
1 : ¥13.73
10 : ¥121.70
100 : ¥1,061.00
1,000 : ¥8,300.00
Bulk
Correct-A-Chip® 1106396
Bulk
Active
- 24 Through Hole DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing - Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.130" (3.30mm) - 3 A
220-3342-19-0602J
RECEPTACLE DIP SOCKET 20POS .3"
68
In Stock
1 : ¥36.02
10 : ¥315.50
25 : ¥754.50
50 : ¥1,460.50
100 : ¥2,824.00
250 : ¥6,670.00
Box
Textool™
Box
Active
Closed Frame 20 Through Hole DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
228-1277-19-0602J
RECEPTACLE DIP SOCKET 28POS .6"
43
In Stock
1 : ¥38.86
10 : ¥340.30
25 : ¥814.00
50 : ¥1,575.50
100 : ¥3,045.00
250 : ¥7,192.50
Box
Textool™
Box
Active
- 28 Through Hole DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing -55°C ~ 125°C Solder UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper - - 1 A
264-4493-19-0602J
RECEPTACLE DIP SOCKET 64POS .9"
5
In Stock
1 : ¥43.60
10 : ¥381.80
25 : ¥913.25
50 : ¥1,767.50
100 : ¥3,417.00
250 : ¥8,070.00
Box
Textool™
Box
Active
- 64 Through Hole DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
47
In Stock
1 : ¥42.75
17 : ¥636.48
102 : ¥3,418.02
Bulk
Correct-A-Chip® 653000
Bulk
Active
Socket Included 28 Through Hole PLCC DIP, 0.6" (15.24mm) Row Spacing - Solder UL94 V-0 - 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass 1 A
218-3341-19-0602J
RECEPTACLE DIP SOCKET 18POS .3"
30
In Stock
1 : ¥33.67
10 : ¥294.80
25 : ¥705.25
50 : ¥1,365.00
100 : ¥2,639.00
250 : ¥6,232.50
Box
Textool™
Box
Active
Closed Frame 18 Through Hole DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
222-3343-09-0602J
SOCKET ADAPTER 22DIP TO 22DIP
40
In Stock
1 : ¥24.67
10 : ¥216.10
30 : ¥620.10
50 : ¥1,000.50
100 : ¥1,934.00
250 : ¥4,567.50
500 : ¥8,870.00
Tube
Textool™
Tube
Active
- 22 Through Hole DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing -55°C ~ 125°C Solder UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) - 1 A
10
In Stock
1 : ¥45.69
15 : ¥628.95
105 : ¥3,866.10
Bulk
Correct-A-Chip® 653000
Bulk
Active
Socket Included 32 Through Hole PLCC DIP, 0.6" (15.24mm) Row Spacing - Solder UL94 V-0 - 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass 1 A
232-1285-19-0602J
RECEPTACLE DIP SOCKET 32POS .6"
11
In Stock
1 : ¥32.62
10 : ¥285.60
30 : ¥819.90
50 : ¥1,322.50
100 : ¥2,557.00
250 : ¥6,040.00
Tube
Textool™
Tube
Active
Closed Frame 32 Through Hole DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
232-1285-29-0602J
RECEPTACLE DIP SOCKET 32POS .6"
30
In Stock
1 : ¥22.55
10 : ¥197.40
30 : ¥566.70
50 : ¥914.00
100 : ¥1,767.00
250 : ¥4,175.00
500 : ¥8,105.00
Box
Textool™
Box
Active
Closed Frame 32 Through Hole DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing -55°C ~ 125°C Solder UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) - 1 A