SMCC_Chip _integrated circuit IC_connector_passive device

制造商

National Semiconductor

Intersil (Renesas Electronics Corporation)

Zetex Semiconductors (Diodes Inc.)

Parallax, Inc.

Roving Networks (Microchip Technology)

Toshiba Electronic Devices and Storage Corporation

Texas Instruments

Spansion (Cypress Semiconductor)

Sanyo Semiconductor/onsemi

STMicroelectronics

NXP Semiconductors

ROHM Semiconductor

NXP Semiconductors

SparkFun

IDT, Integrated Device Technology Inc

Nexperia

Rochester Electronics

NTE Electronics, Inc.

NTE Electronics, Inc

Quality Semiconductor

Harris Corporation

Fairchild Semiconductor

Advanced Micro Devices

Burr Brown

Motorola

系列

10E

10EP

10H

29FCT

54AC

54ALS

54C

54F

54HC

54HCT

54LS

54S

74AC

74ACT

74AHC

74AHCT

74ALS

74AS

74C

74F

74FCT

74HC

74HCS

74HCT

74LPT

74LS

74LV

74LVC

74LVX

74S

74VCX

74VHC

74VHCT

86LS

100E

100EP

100S

4000

4000B

4731B

7400

DM9300

MC9300

QS29FCT521T

Shift Register

TC74VHC

TPIC

包装

切带 (CT)

包

卷带式 (TR)

大部分

托盘

管子

状态

Active

Obsolete

Discontinued

Last Time Buy

Not For New Designs

包装/箱

14-CDIP

14-CDIP (0.300", 7.62mm)

14-CFlatPack

14-DIP (0.300", 7.62mm)

14-QFN Exposed Pad

14-SOIC (0.154", 3.90mm Width)

14-SOIC (0.209", 5.30mm Width)

14-SSOP (0.209", 5.30mm Width)

14-TFSOP (0.173", 4.40mm Width)

14-TSSOP (0.173", 4.40mm Width)

14-VFQFN Exposed Pad

14-WFDFN Exposed Pad

14-WFQFN Exposed Pad

16-CDIP

16-CDIP (0.300", 7.62mm)

16-CFlatPack

16-CFlatpack

16-DIP

16-DIP (0.300", 7.62mm)

16-LSSOP (0.173", 4.40mm Width)

16-SOIC (0.154", 3.90mm Width)

16-SOIC (0.173", 4.40mm Width)

16-SOIC (0.209", 5.30mm Width)

16-SOIC (0.295", 7.50mm Width)

16-SSOP (0.209", 5.30mm Width)

16-TFSOP (0.173", 4.40mm Width)

16-TSSOP (0.173", 4.40mm Width)

16-VFQFN Exposed Pad

16-VFSOP (0.118", 3.00mm Width)

16-WFQFN Exposed Pad

16-XFQFN Exposed Pad

18-DIP (0.300", 7.62mm)

18-SOIC (0.213", 5.40mm Width)

20-CDIP (0.300", 7.62mm)

20-CFlatPack

20-CLCC

20-DIP

20-DIP (0.300", 7.62mm)

20-LCC (J-Lead)

20-SOIC (0.209", 5.30mm Width)

20-SOIC (0.295", 7.50mm Width)

20-SSOP (0.209", 5.30mm Width)

20-TSSOP (0.173", 4.40mm Width)

20-VFQFN Exposed Pad

24-CDIP (0.300", 7.62mm)

24-CDIP (0.400", 10.16mm)

24-CDIP (0.600", 15.24mm)

24-CFlatPack

24-DIP (0.300", 7.62mm)

24-DIP (0.400", 10.16mm)

24-DIP (0.600", 15.24mm)

24-SOIC (0.295", 7.50mm Width)

24-TSSOP (0.173", 4.40mm Width)

28-CDIP (0.400", 10.16mm)

28-CLCC

28-LCC (J-Lead)

32-LQFP

32-VFQFN Exposed Pad

32-WFQFN Exposed Pad

44-LCC (J-Lead)

44-QFP

44-VFQFN Exposed Pad

44-WFQFN Exposed Pad

48-BSSOP (0.295", 7.50mm Width)

48-TFSOP (0.240", 6.10mm Width)

56-TFSOP (0.240", 6.10mm Width)

59-TFBGA

64-BQFP

80-BQFP

100-BQFP

120-BCPGA

120-PGA

169-TFBGA

SOT-23-14 Thin, SOT-23 Variant

SOT-23-16 Thin, SOT-23 Variant

输出类型

Complementary

Complementary, Push-Pull

Non-Inverted

Open Collector

Open Collector, Push-Pull

Open Drain

Push-Pull

Standard

Tri-State

Tri-State, Non-Inverted

安装类型

Surface Mount

Surface Mount, Wettable Flank

Through Hole

元件数量

1

2

4

6

功能

Parallel or Serial to Parallel

Parallel or Serial to Serial

Parallel to Parallel

Parallel to Serial

Parallel to Serial, Serial to Parallel

Serial to Parallel

Serial to Parallel, Serial

Serial to Serial

Standard

Universal

逻辑类型

Register, Bidirectional

Register, D-Type

Register, Multiplexed

Register, Pipeline

Register, Successive Approximation

Register File

Shift Register

工作温度

-25°C ~ 75°C

-25°C ~ 125°C

-40°C ~ 85°C

-40°C ~ 85°C (TA)

-40°C ~ 125°C

-40°C ~ 125°C (TA)

-40°C ~ 150°C

-55°C ~ 85°C

-55°C ~ 125°C

-55°C ~ 125°C (TA)

0°C ~ 70°C

0°C ~ 70°C (TA)

0°C ~ 75°C

0°C ~ 85°C

电压 - 电源

-4.2V ~ -5.5V

-4.2V ~ -5.7V

1.1V ~ 5.5V

1.5V ~ 5.5V

1.7V ~ 5.5V

1.65V ~ 3.6V

1.65V ~ 5.5V

1V ~ 3.6V

1V ~ 5.5V

2.3V ~ 5.5V

2.7V ~ 3.6V

2V ~ 3.6V

2V ~ 5.5V

2V ~ 5.25V

2V ~ 6V

3V ~ 5.5V

3V ~ 5.5V, 3V ~ 13.2V

3V ~ 12V

3V ~ 15V

3V ~ 16V

3V ~ 18V

3V ~ 20V

4.2V ~ 5.5V

4.2V ~ 5.7V

4.5V ~ 5.5V

4.5V ~ 5.25V

4.5V ~ 12.5V

4.5V ~ 15.5V

4.75V ~ 5.5V

4.75V ~ 5.25V

4.94V ~ 5.46V

5.2V

5.5V

5V

5V, 12V

6V ~ 7V

10.8V ~ 13.2V

12V

供应商设备包

14-CDIP

14-CERDIP

14-CFP

14-DHVQFN (2.5x3)

14-DIP

14-MDIP

14-PDIP

14-SO

14-SOIC

14-SOP

14-SOT-23-THIN

14-SSOP

14-TSSOP

14-TVSOP

14-VQFN (3.5x3.5)

14-WQFN (3x2.5)

16-CDIP

16-CERDIP

16-CFP

16-CFlatPack

16-DHVQFN (2.5x3.5)

16-DHXQFN (2x2.4)

16-DIP

16-PDIP

16-QFN (2.5x3.5)

16-SO

16-SOEIAJ

16-SOIC

16-SOP

16-SOT-23-THIN

16-SSOP

16-SSOP-B

16-TSSOP

16-TSSOPB

16-TVSOP

16-VQFN (4x3.5)

16-VSSOP

16-WQFN (2.5x3.5)

16-X1QFN (2.5x2.5)

18-PDIP

18-SOP

20-CDIP

20-CERDIP

20-CFP

20-CFlatPack

20-DHVQFN (4.5x2.5)

20-DIP

20-LCCC (8.89x8.89)

20-PDIP

20-PLCC (9x9)

20-SO

20-SOIC

20-SOP

20-SSOP

20-TSSOP

24-CDIP

24-CERDIP

24-CFlatPack

24-PDIP

24-SO

24-SOIC

24-SOP

24-TSSOP

28-CDIP SB

28-CLCC (11.43x11.43)

28-LCC

28-LCCC (11.43x11.43)

28-PLCC (11.43x11.43)

28-PLCC (11.48x11.48)

28-PLCC (11.51x11.51)

32-LQFP (7x7)

32-QFN (5x5)

32-QFN (6x6)

44-PLCC (16.59x16.59)

44-PQFP (10x10)

44-QFN (7x7)

48-SSOP

48-TSSOP

56-TSSOP

59-TFBGA (8x8)

64-PQFP (20x14)

80-PQFP (14x20)

100-PQFP (20x14)

120-CPGA

120-PGA

169-TFBGA (10x10)

年级

Automotive

每个元素的位数

4

5

8

9

10

12

16

18

20

32

34

40

64

资质

AEC-Q100

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菜单

移位寄存器

制造商

系列

包装